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SERVICES OFFERED

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Architecture and IP Design

  • At QuantumEdge Semiconductor, our deep research expertise enables us to develop robust data models aligned with your product requirements, performance goals, and schedule constraints.

  • These data models support informed decision-making by evaluating trade-offs across business, financial, and technical parameters to achieve optimal time-to-market (TTM).

  • Comprehensive algorithms are developed to monitor and control every stage of design implementation and sign-off.

  • Our customized design flows ensure consistent quality across multiple handoffs, maintaining design integrity throughout the complete development lifecycle.

  • Structured sign-off methodologies and customer-defined quality checklists ensure readiness for seamless progression to the next phase of implementation.

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Circuit and Layout Design

  • Standard Cell Design optimized for performance and scalability

  • High-density, high-speed, and low-power design solutions

  • End-to-end Design, Layout, and Characterization

QuantumEdge

SEMICONUCTOR

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Digital Frontend Design

RTL Design and Integration

  • RTL design implementation and system integration

  • Power intent translation from specifications to UPF

  • UPF and design validation

  • LINT and CDC checks

  • Analog and Mixed-Signal Design including:

1. ADC, DAC, Regulators, PLL, DLL

2. Transmitters (TX) and Receivers (RX)

  • High-speed interfaces such as SerDes, DDR, and other PHY solutions

  • Support for USB, Die-to-Die, and advanced interconnect technologies

  • Post-Layout Extraction (PEX), Simulation, and Verification

  • Comprehensive Physical Verification including ANT, DRC, DFM, LVS, ERC, PAD, PERC, ESD/Latch-up, EMIR/SHE, etc.

  • Memory and IO PAD Library Design with Simulation and AMS Verification

  • RTL handoff and documentation

Verification

  • Verification services for ASIC, SoC, and FPGA designs

  • Industry-standard verification methodologies: VMM, OVM, UVM, RVM, and eRM

  • Intellectual Property (IP) verification

  • Verification planning and assessment

  • Verification environment development using:

  • Bus Functional Models (BFMs)

  • Monitors, checkers, and scoreboards

  • Test pattern and packet generators

  • Comprehensive functional verification

  • Layout execution at Block-level, IP-level, and Full-Chip level

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Digital Backend Design

  • Die size estimation and design feasibility analysis

  • Floorplanning and hierarchical design strategy

  • Pad ring design and Redistribution Layer (RDL) planning

  • Design partitioning and timing/power budgeting

  • Robust power grid design and optimization

  • Low-power design implementation and optimization

  • Block-level and full-chip physical implementation

  • Clock tree synthesis (CTS) and optimization

  • Comprehensive physical verification

  • DRC, LVS, and DFM signoff compliance

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Signoff

  • Timing closure using advanced MCMM methodologies with AI-assisted optimization for faster time-to-market

  • Low-power static signoff for RTL, logical netlist, and physical netlist using CLP/VCLP methodologies

  • RTL-to-Netlist and Netlist-to-Netlist equivalence checking using industry-standard LEC/Formal tools

  • Dynamic power signoff across multiple power and process corners

  • Comprehensive signoff ensuring performance, power, and reliability targets are met

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Design for Test (DFT)

  • IEEE 1687 (IJTAG) implementation and support

  • IEEE 1149.1 / 1149.6 Boundary Scan insertion and validation

  • Memory BIST insertion, repair, and validation

  • Scan chain stitching and optimization

  • Scan compression implementation for test cost reduction

  • Core wrapper and IP test wrapper insertion

  • On-chip clock controller (OCC) insertion

  • Test point insertion for enhanced fault coverage

  • eFuse insertion and validation

  • Test pattern generation and simulation

From Idea to Silicon — Let’s Talk

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