
SERVICES OFFERED
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Architecture and IP Design
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At QuantumEdge Semiconductor, our deep research expertise enables us to develop robust data models aligned with your product requirements, performance goals, and schedule constraints.
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These data models support informed decision-making by evaluating trade-offs across business, financial, and technical parameters to achieve optimal time-to-market (TTM).
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Comprehensive algorithms are developed to monitor and control every stage of design implementation and sign-off.
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Our customized design flows ensure consistent quality across multiple handoffs, maintaining design integrity throughout the complete development lifecycle.
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Structured sign-off methodologies and customer-defined quality checklists ensure readiness for seamless progression to the next phase of implementation.

Circuit and Layout Design
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Standard Cell Design optimized for performance and scalability
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High-density, high-speed, and low-power design solutions
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End-to-end Design, Layout, and Characterization
QuantumEdge
SEMICONUCTOR

Digital Frontend Design
RTL Design and Integration
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RTL design implementation and system integration
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Power intent translation from specifications to UPF
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UPF and design validation
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LINT and CDC checks
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Analog and Mixed-Signal Design including:
1. ADC, DAC, Regulators, PLL, DLL
2. Transmitters (TX) and Receivers (RX)
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High-speed interfaces such as SerDes, DDR, and other PHY solutions
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Support for USB, Die-to-Die, and advanced interconnect technologies
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Post-Layout Extraction (PEX), Simulation, and Verification
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Comprehensive Physical Verification including ANT, DRC, DFM, LVS, ERC, PAD, PERC, ESD/Latch-up, EMIR/SHE, etc.
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Memory and IO PAD Library Design with Simulation and AMS Verification
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RTL handoff and documentation
Verification
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Verification services for ASIC, SoC, and FPGA designs
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Industry-standard verification methodologies: VMM, OVM, UVM, RVM, and eRM
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Intellectual Property (IP) verification
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Verification planning and assessment
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Verification environment development using:
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Bus Functional Models (BFMs)
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Monitors, checkers, and scoreboards
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Test pattern and packet generators
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Comprehensive functional verification
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Layout execution at Block-level, IP-level, and Full-Chip level

Digital Backend Design
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Die size estimation and design feasibility analysis
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Floorplanning and hierarchical design strategy
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Pad ring design and Redistribution Layer (RDL) planning
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Design partitioning and timing/power budgeting
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Robust power grid design and optimization
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Low-power design implementation and optimization
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Block-level and full-chip physical implementation
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Clock tree synthesis (CTS) and optimization
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Comprehensive physical verification
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DRC, LVS, and DFM signoff compliance

Signoff
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Timing closure using advanced MCMM methodologies with AI-assisted optimization for faster time-to-market
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Low-power static signoff for RTL, logical netlist, and physical netlist using CLP/VCLP methodologies
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RTL-to-Netlist and Netlist-to-Netlist equivalence checking using industry-standard LEC/Formal tools
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Dynamic power signoff across multiple power and process corners
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Comprehensive signoff ensuring performance, power, and reliability targets are met

Design for Test (DFT)
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IEEE 1687 (IJTAG) implementation and support
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IEEE 1149.1 / 1149.6 Boundary Scan insertion and validation
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Memory BIST insertion, repair, and validation
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Scan chain stitching and optimization
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Scan compression implementation for test cost reduction
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Core wrapper and IP test wrapper insertion
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On-chip clock controller (OCC) insertion
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Test point insertion for enhanced fault coverage
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eFuse insertion and validation
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Test pattern generation and simulation
From Idea to Silicon — Let’s Talk
